One approach to optimizing DRAM cells involves shrinking feature sizes through advanced lithography techniques. The most recent steps toward footprint reduction pit EUV patterning against ...

Samsung Electronics has reportedly launched a new EUV Task Force (TF ... and ChangXin Memory Technologies (CXMT) are ramping up DRAM production this year, fueling market competition.

The government of Virginia announced that Micron plans to invest up to US$2.17 billion to expand its semiconductor ...

Moreover, Micron’s focus on tech leads can be observed in the ramping of its advanced DRAM and NAND nodes. Production of 1-beta tech nodes supports HBM3E, while 1-gamma nodes using EUV are ...

Since specialty DRAM is not made using leading-edge process technologies, Micron does not need to buy ultra-expensive EUV litho tools for the fab. Yet, for $275 million, it can buy plenty of DUV ...

The HBM devices are 3D stacks of DRAM chips offering an extremely compact and power-efficient solution. As Gen AI capabilities extend beyond data centers to the edge and ultimately endpoint devices ...

KLA's portfolio means it is primed to capitalize on market trends in 2025 like AI and advanced packaging. Learn why KLAC ...

A new technical paper titled “Memory-Centric Computing: Recent Advances in Processing-in-DRAM” was published by researchers at ETH Zurich. “Memory-centric computing aims to enable computation ...

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